TC74HCT373AP vs CD74HCT373M feature comparison

TC74HCT373AP Toshiba America Electronic Components

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CD74HCT373M Rochester Electronics LLC

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Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ROCHESTER ELECTRONICS INC
Part Package Code DIP
Package Description DIP, DIP20,.3 ,
Pin Count 20
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Family HCT HCT
JESD-30 Code R-PDIP-T20 R-PDSO-G20
Length 24.6 mm
Load Capacitance (CL) 150 pF
Logic IC Type BUS DRIVER BUS DRIVER
Max I(ol) 0.006 A
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP20,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Prop. Delay@Nom-Sup 38 ns
Propagation Delay (tpd) 48 ns 53 ns
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 4.45 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 7

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