TC74LCX138FT
vs
7604501FA
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Not Recommended
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
MOTOROLA INC
|
Part Package Code |
TSSOP
|
|
Package Description |
TSSOP, TSSOP16,.25
|
DFP,
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
Toshiba
|
|
Additional Feature |
2 ACTIVE-LOW AND 1 ACTIVE-HIGH ENABLE INPUT
|
|
Family |
LVC/LCX/Z
|
LS
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-GDFP-F16
|
JESD-609 Code |
e4
|
|
Length |
5 mm
|
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
3-LINE TO 8-LINE DECODER
|
SEVEN SEGMENT DECODER/DRIVER
|
Max I(ol) |
0.024 A
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
Package Code |
TSSOP
|
DFP
|
Package Equivalence Code |
TSSOP16,.25
|
FL16,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
FLATPACK
|
Prop. Delay@Nom-Sup |
6 ns
|
|
Propagation Delay (tpd) |
7 ns
|
158 ns
|
Qualification Status |
Not Qualified
|
|
Seated Height-Max |
1.2 mm
|
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
TTL
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
|
Terminal Form |
GULL WING
|
FLAT
|
Terminal Pitch |
0.65 mm
|
|
Terminal Position |
DUAL
|
DUAL
|
Width |
4.4 mm
|
|
Base Number Matches |
2
|
1
|
Output Characteristics |
|
OPEN-COLLECTOR
|
Screening Level |
|
MIL-STD-883
|
|
|
|
Compare TC74LCX138FT with alternatives
Compare 7604501FA with alternatives