TC74LCX74FT(EK2,M)
vs
HD74LVC74TELL
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
TOSHIBA CORP
|
RENESAS TECHNOLOGY CORP
|
| Package Description |
TSSOP,
|
TSSOP-14
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Toshiba
|
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
No
|
| Part Package Code |
|
TSSOP
|
| Pin Count |
|
14
|
| Family |
|
LVC/LCX/Z
|
| JESD-30 Code |
|
R-PDSO-G14
|
| Length |
|
5 mm
|
| Load Capacitance (CL) |
|
50 pF
|
| Logic IC Type |
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
|
150000000 Hz
|
| Max I(ol) |
|
0.024 A
|
| Moisture Sensitivity Level |
|
1
|
| Number of Bits |
|
1
|
| Number of Functions |
|
2
|
| Number of Terminals |
|
14
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Output Polarity |
|
COMPLEMENTARY
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSSOP
|
| Package Equivalence Code |
|
TSSOP14,.25
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Prop. Delay@Nom-Sup |
|
8 ns
|
| Propagation Delay (tpd) |
|
9 ns
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
2 V
|
| Supply Voltage-Nom (Vsup) |
|
2.7 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.65 mm
|
| Terminal Position |
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
| Trigger Type |
|
POSITIVE EDGE
|
| Width |
|
4.4 mm
|
| fmax-Min |
|
150 MHz
|
|
|
|
Compare TC74LCX74FT(EK2,M) with alternatives
Compare HD74LVC74TELL with alternatives