TC74LVXC3245FS(ELP) vs MC74LVX4245DW feature comparison

TC74LVXC3245FS(ELP) Toshiba America Electronic Components

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MC74LVX4245DW onsemi

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Pbfree Code No
Rohs Code No No
Part Life Cycle Code End Of Life Obsolete
Ihs Manufacturer TOSHIBA CORP ON SEMICONDUCTOR
Part Package Code SSOP SOIC
Package Description LSSOP, SOP, SOP24,.4
Pin Count 24 24
Reach Compliance Code unknown not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature WITH DIRECTION CONTROL; PORT B OPERATING AT 3 TO 5.5 VOLTS 3.3V SUPPLY FOR PORT A; 5V SUPPLY FOR PORT B
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G24 R-PDSO-G24
Length 7.8 mm 15.395 mm
Load Capacitance (CL) 50 pF
Logic IC Type BUS TRANSCEIVER BUS TRANSCEIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 24 24
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED 235
Propagation Delay (tpd) 9 ns 10 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.65 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 5.6 mm 7.5 mm
Base Number Matches 1 5
Factory Lead Time 4 Weeks
Control Type COMMON CONTROL
Count Direction BIDIRECTIONAL
JESD-609 Code e0
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Package Equivalence Code SOP24,.4
Packing Method RAIL
Prop. Delay@Nom-Sup 9 ns
Supply Voltage-Nom (Vsup) 3.3 V
Terminal Finish TIN LEAD

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