TC74VHC139FK
vs
HD74HC155FPEL
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
TOSHIBA CORP
|
RENESAS ELECTRONICS CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
VSSOP,
|
SOP, SOP16,.3
|
Pin Count |
16
|
16
|
Reach Compliance Code |
unknown
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
AHC/VHC/H/U/V
|
HC/UH
|
Input Conditioning |
STANDARD
|
STANDARD
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
4 mm
|
10.06 mm
|
Logic IC Type |
2-LINE TO 4-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
Number of Functions |
2
|
2
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
INVERTED
|
INVERTED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSSOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
Propagation Delay (tpd) |
16.5 ns
|
200 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1 mm
|
2.2 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
4.5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
20
|
Width |
3 mm
|
5.5 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
SOP16,.3
|
Packing Method |
|
TR
|
Prop. Delay@Nom-Sup |
|
40 ns
|
|
|
|
Compare TC74VHC139FK with alternatives
Compare HD74HC155FPEL with alternatives