TC74VHC32FK vs HD74LV32AFP feature comparison

TC74VHC32FK Toshiba America Electronic Components

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HD74LV32AFP Renesas Electronics Corporation

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Active Not Recommended
Ihs Manufacturer TOSHIBA CORP RENESAS ELECTRONICS CORP
Part Package Code SSOP SOIC
Package Description VSSOP, TSSOP14,.16,20 SOP,
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer Toshiba
Family AHC/VHC/H/U/V LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 4 mm 10.06 mm
Load Capacitance (CL) 50 pF
Logic IC Type OR GATE OR GATE
Max I(ol) 0.008 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSSOP SOP
Package Equivalence Code TSSOP14,.16,20
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 50 mA
Prop. Delay@Nom-Sup 13 ns
Propagation Delay (tpd) 13 ns 19 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 2.2 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3 mm 5.5 mm
Base Number Matches 1 2
Date Of Intro 1999-09-02
JESD-609 Code e0
Terminal Finish TIN LEAD

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