TC7SG07FE vs 74AUP1G07FX4-7 feature comparison

TC7SG07FE Toshiba America Electronic Components

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74AUP1G07FX4-7 Diodes Incorporated

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Part Life Cycle Code End Of Life Active
Ihs Manufacturer TOSHIBA CORP DIODES INC
Part Package Code SON DFN
Package Description VSOF, VFBGA, SOLCC6,.04,20
Pin Count 5 6
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family LVP AUP/ULP/V
JESD-30 Code R-PDSO-F5 R-PBGA-B6
Length 1.6 mm 1.4 mm
Logic IC Type BUFFER BUFFER
Number of Functions 1 1
Number of Inputs 1 1
Number of Terminals 5 6
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics OPEN-DRAIN OPEN-DRAIN
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VSOF VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, VERY THIN PROFILE GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Propagation Delay (tpd) 26.7 ns 20.7 ns
Seated Height-Max 0.6 mm 0.4 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 0.9 V 0.8 V
Supply Voltage-Nom (Vsup) 3.3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form FLAT BALL
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position DUAL BOTTOM
Width 1.2 mm 0.9 mm
Base Number Matches 3 1
Rohs Code Yes
ECCN Code EAR99
Factory Lead Time 24 Weeks
Samacsys Manufacturer Diodes Incorporated
JESD-609 Code e4
Load Capacitance (CL) 30 pF
Max I(ol) 0.0017 A
Moisture Sensitivity Level 1
Package Equivalence Code SOLCC6,.04,20
Packing Method TR
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 20.7 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Terminal Finish NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s) 30

Compare TC7SG07FE with alternatives

Compare 74AUP1G07FX4-7 with alternatives