TC7SG07FE
vs
74AUP1G17FX4-7
feature comparison
Part Life Cycle Code |
End Of Life
|
Active
|
Ihs Manufacturer |
TOSHIBA CORP
|
DIODES INC
|
Part Package Code |
SON
|
DFN
|
Package Description |
VSOF,
|
VFBGA, BGA6,2X3,20
|
Pin Count |
5
|
6
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVP
|
AUP/ULP/V
|
JESD-30 Code |
R-PDSO-F5
|
R-PBGA-B6
|
Length |
1.6 mm
|
1.4 mm
|
Logic IC Type |
BUFFER
|
BUFFER
|
Number of Functions |
1
|
1
|
Number of Inputs |
1
|
1
|
Number of Terminals |
5
|
6
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Characteristics |
OPEN-DRAIN
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VSOF
|
VFBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, VERY THIN PROFILE
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
Propagation Delay (tpd) |
26.7 ns
|
20.1 ns
|
Seated Height-Max |
0.6 mm
|
0.4 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
0.9 V
|
0.8 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Form |
FLAT
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
DUAL
|
BOTTOM
|
Width |
1.2 mm
|
0.9 mm
|
Base Number Matches |
3
|
1
|
Rohs Code |
|
Yes
|
ECCN Code |
|
EAR99
|
Factory Lead Time |
|
24 Weeks
|
Samacsys Manufacturer |
|
Diodes Incorporated
|
JESD-609 Code |
|
e4
|
Load Capacitance (CL) |
|
30 pF
|
Max I(ol) |
|
0.0017 A
|
Moisture Sensitivity Level |
|
1
|
Package Equivalence Code |
|
BGA6,2X3,20
|
Packing Method |
|
TR
|
Peak Reflow Temperature (Cel) |
|
260
|
Prop. Delay@Nom-Sup |
|
20.1 ns
|
Qualification Status |
|
Not Qualified
|
Schmitt Trigger |
|
YES
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TC7SG07FE with alternatives
Compare 74AUP1G17FX4-7 with alternatives