TC7SZ08FU(TE85L,F) vs 74LVC1G08GW-R feature comparison

TC7SZ08FU(TE85L,F) Toshiba America Electronic Components

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74LVC1G08GW-R NXP Semiconductors

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP NXP SEMICONDUCTORS
Part Package Code SSOP
Package Description TSSOP, TSSOP5/6,.08 TSSOP,
Pin Count 5
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G5 R-PDSO-G5
Length 2 mm 2.05 mm
Load Capacitance (CL) 50 pF
Logic IC Type AND GATE AND GATE
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Inputs 2 2
Number of Terminals 5 5
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Equivalence Code TSSOP5/6,.08
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Prop. Delay@Nom-Sup 5.5 ns
Propagation Delay (tpd) 10.5 ns 10.5 ns
Qualification Status Not Qualified
Schmitt Trigger NO
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 1.8 V 1.65 V
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 1.25 mm 1.25 mm
Base Number Matches 1 1

Compare TC7SZ08FU(TE85L,F) with alternatives

Compare 74LVC1G08GW-R with alternatives