TC7WH04FK
vs
TC7WH04FC
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
End Of Life
|
| Ihs Manufacturer |
TOSHIBA CORP
|
TOSHIBA CORP
|
| Part Package Code |
SOIC
|
SON
|
| Package Description |
VSSOP, TSSOP8,.12,20
|
HVSSON, SOLCC8,.05,16
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
Toshiba
|
|
| Family |
LV/LV-A/LVX/H
|
LV/LV-A/LVX/H
|
| JESD-30 Code |
R-PDSO-G8
|
R-PDSO-N8
|
| Length |
2.3 mm
|
1.45 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Max I(ol) |
0.008 A
|
0.004 A
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VSSOP
|
HVSSON
|
| Package Equivalence Code |
TSSOP8,.12,20
|
SOLCC8,.05,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Power Supply Current-Max (ICC) |
50 mA
|
|
| Prop. Delay@Nom-Sup |
12 ns
|
12 ns
|
| Propagation Delay (tpd) |
12 ns
|
12 ns
|
| Schmitt Trigger |
NO
|
NO
|
| Screening Level |
AEC-Q100
|
|
| Seated Height-Max |
0.9 mm
|
0.4 mm
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.4 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
2 mm
|
1.35 mm
|
| Base Number Matches |
5
|
2
|
| JESD-609 Code |
|
e0
|
| Qualification Status |
|
Not Qualified
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|