TDA08H0SB1R
vs
MCDM(R)-08-T
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
C & K COMPONENTS LLC
|
SPC TECHNOLOGY/ MULTICOMP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8536.50.90.65
|
8536.50.90.65
|
| Factory Lead Time |
48 Weeks
|
|
| Actuator Material |
LIQUID CRYSTAL POLYMER
|
|
| Actuator Type |
SLIDE
|
|
| Additional Feature |
ROHS COMPLIANT
|
LOW PROFILE
|
| Body Breadth |
6.2 mm
|
6.2 mm
|
| Body Height |
2.2 mm
|
|
| Body Length or Diameter |
11.29 mm
|
21.26 mm
|
| Center Contact Material |
COPPER ALLOY
|
|
| Center Contact Plating |
GOLD OVER NICKEL
|
|
| Contact Current(DC)-Max |
0.025 A
|
0.025 A
|
| Contact (DC) Max Rating R Load |
.025A@24VDC
|
.025A@24VDC
|
| Contact Resistance |
0.1 mΩ
|
|
| Contact Voltage(DC)-Max |
24 V
|
24 V
|
| Dielectric Withstand Volts |
300VAC V
|
|
| Electrical Life |
1000 Cycle(s)
|
2000 Cycle(s)
|
| End Contact Material |
COPPER ALLOY
|
|
| End Contact Plating |
GOLD OVER NICKEL
|
|
| Housing Material |
POLYPHENYLENE SULPHIDE
|
|
| Insulation Resistance |
100000000 Ω
|
|
| Insulator Material |
POLYPHENYLENE SULPHIDE
|
|
| JESD-609 Code |
e4
|
|
| Mounting Feature |
SURFACE MOUNT-STRAIGHT
|
SURFACE MOUNT-STRAIGHT
|
| Number of Positions |
8
|
|
| Number of Switch Sections |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Packing Method |
TAPE AND REEL
|
|
| Sealing |
TAPE SEALED
|
TOP TAPE SEALED
|
| Solderability |
MIL-STD
|
|
| Surface Mount |
NO
|
NO
|
| Switch Action |
LATCHED
|
LATCHED
|
| Switch Function |
SPST
|
SPST
|
| Switch Type |
SLIDE DIP SWITCH
|
SLIDE DIP SWITCH
|
| Terminal Finish |
GOLD OVER NICKEL
|
|
| Terminal Material |
COPPER ALLOY
|
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TDA08H0SB1R with alternatives
Compare MCDM(R)-08-T with alternatives