TDA3653B
vs
TDA8357J
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
SFM
|
|
| Package Description |
PLASTIC, SOT-110B, SIP-9
|
ZIP, ZIP9,.2
|
| Pin Count |
9
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV
|
|
| Blanking Output |
NO
|
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PSFM-T9
|
R-PZIP-T9
|
| Number of Functions |
1
|
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
150 °C
|
70 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SIP
|
ZIP
|
| Package Equivalence Code |
SIP9,.06
|
ZIP9,.2
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
40 V
|
|
| Supply Voltage-Min (Vsup) |
10 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BCDMOS
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
1.27 mm
|
| Terminal Position |
SINGLE
|
ZIG-ZAG
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Base Number Matches |
2
|
2
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
Matte Tin (Sn)
|
|
|
|
Compare TDA3653B with alternatives