TDA3653BU
vs
TDA3654
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SFM
|
SIP
|
| Package Description |
POWER, PLASTIC, SOT-110-1, SIP-9
|
SIP,
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Blanking Output |
NO
|
YES
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PSFM-T9
|
R-PSIP-T9
|
| JESD-609 Code |
e3
|
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
150 °C
|
60 °C
|
| Operating Temperature-Min |
|
-25 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SIP9,.1TB
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
FLANGE MOUNT
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
60 V
|
40 V
|
| Supply Voltage-Min (Vsup) |
10 V
|
10 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
4
|
| Package Code |
|
SIP
|
|
|
|
Compare TDA3653BU with alternatives
Compare TDA3654 with alternatives