TDA3653BU
vs
TDA8359J/N2,112
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
, SIP9,.1TB
|
ZIP,
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
150 °C
|
85 °C
|
Operating Temperature-Min |
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
SIP9,.1TB
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Surface Mount |
NO
|
NO
|
Technology |
BIPOLAR
|
BCDMOS
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
SINGLE
|
ZIG-ZAG
|
Base Number Matches |
2
|
1
|
Part Package Code |
|
ZIP
|
Pin Count |
|
9
|
Application |
|
TV
|
Blanking Output |
|
NO
|
JESD-30 Code |
|
R-PZIP-T9
|
JESD-609 Code |
|
e3
|
Length |
|
13 mm
|
Number of Functions |
|
1
|
Package Code |
|
ZIP
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Seated Height-Max |
|
21.4 mm
|
Supply Voltage-Max (Vsup) |
|
18 V
|
Supply Voltage-Min (Vsup) |
|
7.5 V
|
Terminal Finish |
|
TIN
|
Terminal Form |
|
THROUGH-HOLE
|
Width |
|
2.5 mm
|
|
|
|
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