TDA3653BU vs TDA8359J/N2,112 feature comparison

TDA3653BU Philips Semiconductors

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TDA8359J/N2,112 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer PHILIPS SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description , SIP9,.1TB ZIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Consumer IC Type VERTICAL DEFLECTION IC VERTICAL DEFLECTION IC
Number of Terminals 9 9
Operating Temperature-Max 150 °C 85 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code SIP9,.1TB
Qualification Status Not Qualified Not Qualified
Surface Mount NO NO
Technology BIPOLAR BCDMOS
Temperature Grade OTHER OTHER
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position SINGLE ZIG-ZAG
Base Number Matches 2 1
Part Package Code ZIP
Pin Count 9
Application TV
Blanking Output NO
JESD-30 Code R-PZIP-T9
JESD-609 Code e3
Length 13 mm
Number of Functions 1
Package Code ZIP
Package Shape RECTANGULAR
Package Style IN-LINE
Seated Height-Max 21.4 mm
Supply Voltage-Max (Vsup) 18 V
Supply Voltage-Min (Vsup) 7.5 V
Terminal Finish TIN
Terminal Form THROUGH-HOLE
Width 2.5 mm

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