TDA3653C/N2
vs
TDA2654
feature comparison
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
SIP
|
|
Package Description |
SIP,
|
, SIP9,.1TB
|
Pin Count |
9
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Blanking Output |
NO
|
|
Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
JESD-30 Code |
R-PSIP-T9
|
|
Length |
23.8 mm
|
|
Number of Functions |
1
|
|
Number of Terminals |
9
|
9
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SIP
|
|
Package Equivalence Code |
SIP9,.1
|
SIP9,.1TB
|
Package Shape |
RECTANGULAR
|
|
Package Style |
IN-LINE
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
14.2 mm
|
|
Supply Voltage-Max (Vsup) |
60 V
|
|
Supply Voltage-Min (Vsup) |
10 V
|
|
Surface Mount |
NO
|
NO
|
Terminal Form |
THROUGH-HOLE
|
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
SINGLE
|
SINGLE
|
Width |
4.4 mm
|
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
JESD-609 Code |
|
e0
|
Operating Temperature-Max |
|
150 °C
|
Operating Temperature-Min |
|
|
Technology |
|
BIPOLAR
|
Temperature Grade |
|
OTHER
|
Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
Compare TDA3653C/N2 with alternatives