TDA3653C vs TDA8357J feature comparison

TDA3653C NXP Semiconductors

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TDA8357J Philips Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer NXP SEMICONDUCTORS PHILIPS SEMICONDUCTORS
Part Package Code SIP
Package Description SIP, SIP9,.07 ZIP, ZIP9,.2
Pin Count 9
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Application TV
Blanking Output NO
Consumer IC Type VERTICAL DEFLECTION IC VERTICAL DEFLECTION IC
JESD-30 Code R-PSIP-T9 R-PZIP-T9
Number of Functions 1
Number of Terminals 9 9
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SIP ZIP
Package Equivalence Code SIP9,.07 ZIP9,.2
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 40 V
Supply Voltage-Min (Vsup) 10 V
Surface Mount NO NO
Technology BIPOLAR BCDMOS
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position SINGLE ZIG-ZAG
Base Number Matches 2 2
JESD-609 Code e3
Operating Temperature-Max 70 °C
Operating Temperature-Min -25 °C
Temperature Grade OTHER
Terminal Finish Matte Tin (Sn)

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