TDA3654AU
vs
KA2131
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
SAMSUNG SEMICONDUCTOR INC
|
| Part Package Code |
SIP
|
SFM
|
| Package Description |
ZIP,
|
, SIP9,.1TB
|
| Pin Count |
9
|
9
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV; MONITOR
|
TV
|
| Blanking Output |
YES
|
YES
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PZIP-T9
|
R-PSFM-T9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
60 °C
|
70 °C
|
| Operating Temperature-Min |
-25 °C
|
-20 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
17 mm
|
|
| Supply Voltage-Max (Vsup) |
40 V
|
24 V
|
| Supply Voltage-Min (Vsup) |
10 V
|
24 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
OTHER
|
COMMERCIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
ZIG-ZAG
|
SINGLE
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
No
|
| JESD-609 Code |
|
e0
|
| Package Equivalence Code |
|
SIP9,.1TB
|
| Technology |
|
BIPOLAR
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare TDA3654AU with alternatives
Compare KA2131 with alternatives