TDA3654U
vs
TDA2654
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Package Description |
, SIP9,.1
|
, SIP9,.1TB
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-609 Code |
e0
|
e0
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
60 °C
|
150 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Equivalence Code |
SIP9,.1
|
SIP9,.1TB
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
BIPOLAR
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
Tin/Lead (Sn/Pb)
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
2
|
2
|
|
|
|