TDA7056BU
vs
TDA7056AT
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Package Description |
SIP,
|
7.50 MM, PLASTIC, MS-013, SOT163-1, SOP-20
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
NXP
|
Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
JESD-30 Code |
R-PSIP-T9
|
R-PDSO-G20
|
Number of Terminals |
9
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SIP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Surface Mount |
NO
|
YES
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Position |
SINGLE
|
DUAL
|
Base Number Matches |
1
|
6
|
Pbfree Code |
|
Yes
|
Rohs Code |
|
Yes
|
Part Package Code |
|
SOIC
|
Pin Count |
|
20
|
Harmonic Distortion |
|
0.3%
|
Length |
|
12.8 mm
|
Number of Channels |
|
1
|
Number of Functions |
|
1
|
Package Equivalence Code |
|
SOP20,.4
|
Peak Reflow Temperature (Cel) |
|
260
|
Seated Height-Max |
|
2.65 mm
|
Supply Current-Max |
|
16 mA
|
Terminal Pitch |
|
1.27 mm
|
Time@Peak Reflow Temperature-Max (s) |
|
40
|
Width |
|
7.5 mm
|
|
|
|
Compare TDA7056BU with alternatives
Compare TDA7056AT with alternatives