TDA7056BU
vs
TDA7056B
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
SIP,
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Samacsys Manufacturer |
NXP
|
|
| Consumer IC Type |
VOLUME CONTROL CIRCUIT
|
VOLUME CONTROL CIRCUIT
|
| JESD-30 Code |
R-PSIP-T9
|
R-PSIP-T9
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SIP
|
SIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Max (Vsup) |
18 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Surface Mount |
NO
|
NO
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Position |
SINGLE
|
SINGLE
|
| Base Number Matches |
1
|
3
|
| Rohs Code |
|
Yes
|
| Harmonic Distortion |
|
0.3%
|
| Number of Channels |
|
1
|
| Number of Functions |
|
1
|
| Package Equivalence Code |
|
SIP9,.1TB
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Supply Current-Max |
|
13 mA
|
| Technology |
|
BIPOLAR
|
| Terminal Pitch |
|
2.54 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
40
|
|
|
|
Compare TDA7056BU with alternatives
Compare TDA7056B with alternatives