TDA7564B vs TDA7564BPD feature comparison

TDA7564B STMicroelectronics

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TDA7564BPD STMicroelectronics

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code ZFM SOIC
Package Description FLEXIWATT-25 HSSOP, SSOP36,.56
Pin Count 25 36
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.33.00.01 8542.33.00.01
Samacsys Manufacturer STMicroelectronics
Bandwidth-Nom 22 kHz 22 kHz
Consumer IC Type CLASS AB AUDIO AMPLIFIER CLASS AB AUDIO AMPLIFIER
Gain 26 dB 26 dB
Harmonic Distortion 10% 10%
JESD-30 Code R-XZFM-T25 R-PDSO-G36
JESD-609 Code e3 e3
Moisture Sensitivity Level 3 3
Number of Channels 4 4
Number of Functions 1 1
Number of Terminals 25 36
Output Power-Nom 50 W 50 W
Package Body Material UNSPECIFIED PLASTIC/EPOXY
Package Code ZIP HSSOP
Package Equivalence Code ZIP25,.16,.16,40 SSOP36,.56
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Supply Current-Max 300 mA 300 mA
Supply Voltage-Max (Vsup) 18 V 18 V
Supply Voltage-Min (Vsup) 8 V 8 V
Surface Mount NO YES
Technology BCDMOS BCDMOS
Terminal Finish Tin (Sn) MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 1 mm 0.65 mm
Terminal Position ZIG-ZAG DUAL
Time@Peak Reflow Temperature-Max (s) 30
Base Number Matches 1 1
Length 15.9 mm
Seated Height-Max 3.41 mm
Width 11 mm

Compare TDA7564B with alternatives

Compare TDA7564BPD with alternatives