TDA7569BDLVPDTR
vs
TDA7569BLVH
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Reach Compliance Code |
compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Factory Lead Time |
15 Weeks
|
52 Weeks
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
3
|
3
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
245
|
Terminal Finish |
Tin (Sn) - reflowed
|
MATTE TIN
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Base Number Matches |
1
|
1
|
JESD-30 Code |
|
R-PZIP-T27
|
Number of Functions |
|
4
|
Number of Terminals |
|
27
|
Operating Temperature-Max |
|
105 °C
|
Operating Temperature-Min |
|
-40 °C
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Code |
|
ZIP
|
Package Equivalence Code |
|
ZIP27H,.14,.7,40
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
IN-LINE
|
Qualification Status |
|
Not Qualified
|
Supply Current-Max |
|
250 mA
|
Surface Mount |
|
NO
|
Technology |
|
BCDMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Form |
|
THROUGH-HOLE
|
Terminal Pitch |
|
1 mm
|
Terminal Position |
|
ZIG-ZAG
|
|
|
|
Compare TDA7569BDLVPDTR with alternatives
Compare TDA7569BLVH with alternatives