TDA7569BLV
vs
TDA7569BDLVPD
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Factory Lead Time |
15 Weeks
|
20 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
AUDIO AMPLIFIER
|
| JESD-30 Code |
R-PZIP-T27
|
|
| JESD-609 Code |
e3
|
e3
|
| Number of Functions |
4
|
|
| Number of Terminals |
16
|
|
| Operating Temperature-Max |
105 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
|
| Package Code |
ZIP
|
|
| Package Equivalence Code |
ZIP27,.16,.16,40
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Qualification Status |
Not Qualified
|
|
| Supply Current-Max |
250 mA
|
|
| Surface Mount |
NO
|
|
| Technology |
BCDMOS
|
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin (Sn)
|
Tin (Sn) - reflowed
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
1 mm
|
|
| Terminal Position |
ZIG-ZAG
|
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
| Base Number Matches |
8
|
2
|
| Moisture Sensitivity Level |
|
3
|
|
|
|
Compare TDA7569BLV with alternatives
Compare TDA7569BDLVPD with alternatives