TDA7569BLVSMTR
vs
TDA7569BLV
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Reach Compliance Code |
not_compliant
|
not_compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.33.00.01
|
8542.33.00.01
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Consumer IC Type |
CLASS AB AUDIO AMPLIFIER
|
CLASS AB AUDIO AMPLIFIER
|
JESD-30 Code |
R-PZIP-T27
|
R-PZIP-T27
|
JESD-609 Code |
e3
|
e3
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
4
|
4
|
Number of Terminals |
27
|
16
|
Operating Temperature-Max |
105 °C
|
105 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
ZIP
|
ZIP
|
Package Equivalence Code |
ZIP27H,.08,.7
|
ZIP27,.16,.16,40
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
245
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Current-Max |
250 mA
|
250 mA
|
Surface Mount |
NO
|
NO
|
Technology |
BCDMOS
|
BCDMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Matte Tin (Sn) - annealed
|
Tin (Sn)
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
1 mm
|
Terminal Position |
ZIG-ZAG
|
ZIG-ZAG
|
Time@Peak Reflow Temperature-Max (s) |
30
|
NOT SPECIFIED
|
Base Number Matches |
1
|
1
|
Rohs Code |
|
Yes
|
Factory Lead Time |
|
15 Weeks
|
|
|
|
Compare TDA7569BLVSMTR with alternatives
Compare TDA7569BLV with alternatives