TDA8035HN/C2/S1J
vs
TDA8035HN/C2/S1QL
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
QFN
|
Package Description |
HVQCCN,
|
|
Pin Count |
32
|
32
|
Manufacturer Package Code |
SOT617-7
|
SOT617-7
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
|
Factory Lead Time |
13 Weeks
|
4 Weeks
|
Samacsys Manufacturer |
NXP
|
NXP
|
Analog IC - Other Type |
ANALOG CIRCUIT
|
ANALOG CIRCUIT
|
JESD-30 Code |
S-PQCC-N32
|
|
JESD-609 Code |
e4
|
|
Length |
5 mm
|
|
Moisture Sensitivity Level |
1
|
1
|
Number of Functions |
1
|
|
Number of Terminals |
32
|
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-25 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
|
Package Code |
HVQCCN
|
|
Package Shape |
SQUARE
|
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Seated Height-Max |
1 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
2.7 V
|
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
|
Surface Mount |
YES
|
|
Temperature Grade |
OTHER
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
NO LEAD
|
|
Terminal Pitch |
0.5 mm
|
|
Terminal Position |
QUAD
|
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
5 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|