TDA8143
vs
TDA3654AU
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
NXP SEMICONDUCTORS
|
Part Package Code |
SFM
|
SIP
|
Package Description |
SIP-9
|
ZIP,
|
Pin Count |
9
|
9
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Application |
TV
|
TV; MONITOR
|
Blanking Output |
NO
|
YES
|
Consumer IC Type |
HORIZONTAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
JESD-30 Code |
R-PSFM-T9
|
R-PZIP-T9
|
JESD-609 Code |
e0
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
9
|
9
|
Operating Temperature-Max |
70 °C
|
60 °C
|
Operating Temperature-Min |
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Equivalence Code |
SIP9,.1TB
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
FLANGE MOUNT
|
IN-LINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
18 V
|
40 V
|
Supply Voltage-Min (Vsup) |
7 V
|
10 V
|
Surface Mount |
NO
|
NO
|
Temperature Grade |
COMMERCIAL
|
OTHER
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
SINGLE
|
ZIG-ZAG
|
Base Number Matches |
1
|
1
|
Package Code |
|
ZIP
|
Seated Height-Max |
|
17 mm
|
|
|
|
Compare TDA8143 with alternatives
Compare TDA3654AU with alternatives