TDA8356 vs TDA3653BU feature comparison

TDA8356 NXP Semiconductors

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TDA3653BU NXP Semiconductors

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Source Content uid TDA8356 TDA3653BU
Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Part Package Code SIP SFM
Package Description POWER, PLASTIC, SOT-131-2, SIP-9 POWER, PLASTIC, SOT-110-1, SIP-9
Pin Count 9 9
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Blanking Output NO NO
Consumer IC Type VERTICAL DEFLECTION IC VERTICAL DEFLECTION IC
JESD-30 Code R-PSIP-T9 R-PSFM-T9
JESD-609 Code e3 e3
Length 23.8 mm
Number of Functions 1 1
Number of Terminals 9 9
Operating Temperature-Max 75 °C 150 °C
Operating Temperature-Min -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SIP
Package Equivalence Code SIP9,.1 SIP9,.1TB
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE FLANGE MOUNT
Power Supplies 9/25 V 10/40 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 14.2 mm
Supply Voltage-Max (Vsup) 25 V 60 V
Supply Voltage-Min (Vsup) 9 V 10 V
Surface Mount NO NO
Technology BIPOLAR BIPOLAR
Temperature Grade COMMERCIAL EXTENDED OTHER
Terminal Finish MATTE TIN TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position SINGLE SINGLE
Width 4.4 mm
Base Number Matches 2 1

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