TDA8357J
vs
935084350112
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
ZIP, ZIP9,.2
|
,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PZIP-T9
|
R-PSFM-T9
|
| JESD-609 Code |
e3
|
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
70 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
|
| Package Equivalence Code |
ZIP9,.2
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
FLANGE MOUNT
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Surface Mount |
NO
|
NO
|
| Technology |
BCDMOS
|
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
Matte Tin (Sn)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
ZIG-ZAG
|
SINGLE
|
| Base Number Matches |
2
|
1
|
| Part Package Code |
|
SFM
|
| Pin Count |
|
9
|
| Blanking Output |
|
NO
|
| Number of Functions |
|
1
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Supply Voltage-Max (Vsup) |
|
60 V
|
| Supply Voltage-Min (Vsup) |
|
10 V
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
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