TDA8359J/N2,112
vs
TDA3653CU
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
ZIP
|
|
| Package Description |
ZIP,
|
, SIP9,.1TB
|
| Pin Count |
9
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Application |
TV
|
|
| Blanking Output |
NO
|
|
| Consumer IC Type |
VERTICAL DEFLECTION IC
|
VERTICAL DEFLECTION IC
|
| JESD-30 Code |
R-PZIP-T9
|
|
| JESD-609 Code |
e3
|
e0
|
| Length |
13 mm
|
|
| Number of Functions |
1
|
|
| Number of Terminals |
9
|
9
|
| Operating Temperature-Max |
85 °C
|
150 °C
|
| Operating Temperature-Min |
-25 °C
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
ZIP
|
|
| Package Shape |
RECTANGULAR
|
|
| Package Style |
IN-LINE
|
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
21.4 mm
|
|
| Supply Voltage-Max (Vsup) |
18 V
|
|
| Supply Voltage-Min (Vsup) |
7.5 V
|
|
| Surface Mount |
NO
|
NO
|
| Technology |
BCDMOS
|
BIPOLAR
|
| Temperature Grade |
OTHER
|
OTHER
|
| Terminal Finish |
Tin (Sn)
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
ZIG-ZAG
|
SINGLE
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
2.5 mm
|
|
| Base Number Matches |
1
|
2
|
| Package Equivalence Code |
|
SIP9,.1TB
|
|
|
|
Compare TDA8359J/N2,112 with alternatives