TDA9181P
vs
TDA9183T
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Transferred
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
PHILIPS SEMICONDUCTORS
|
Part Package Code |
DIP
|
|
Package Description |
0.300 INCH, PLASTIC, SOT38-4, DIP-16
|
|
Pin Count |
16
|
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Consumer IC Type |
Y/C SEPARATOR IC
|
|
JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G16
|
Length |
19.05 mm
|
|
Number of Functions |
1
|
|
Number of Terminals |
16
|
16
|
Operating Temperature-Max |
70 °C
|
70 °C
|
Operating Temperature-Min |
-25 °C
|
-25 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP16,.3
|
SOP16,.4
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.2 mm
|
|
Supply Voltage-Max (Vsup) |
5.5 V
|
|
Supply Voltage-Min (Vsup) |
4.5 V
|
|
Surface Mount |
NO
|
YES
|
Temperature Grade |
OTHER
|
OTHER
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
|
Base Number Matches |
1
|
2
|
JESD-609 Code |
|
e4
|
Terminal Finish |
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
|
|
Compare TDA9181P with alternatives