TDE1898CSP vs TDE1898CDP feature comparison

TDE1898CSP STMicroelectronics

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TDE1898CDP STMicroelectronics

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer STMICROELECTRONICS STMICROELECTRONICS
Part Package Code SFM DIP
Package Description SIP-9 MINI, DIP-8
Pin Count 9 8
Reach Compliance Code not_compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Built-in Protections OVER CURRENT; THERMAL; UNDER VOLTAGE OVER CURRENT; THERMAL; UNDER VOLTAGE
Driver Number of Bits 1 1
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code R-PSFM-T9 R-PDIP-T8
JESD-609 Code e0 e3
Number of Functions 1 1
Number of Terminals 9 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Output Current Flow Direction SOURCE SOURCE
Output Current-Max 0.625 A 0.625 A
Output Peak Current Limit-Nom 0.75 A 0.75 A
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Equivalence Code SIP9,.07TB DIP8,.35
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT IN-LINE
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max 35 V 35 V
Supply Voltage-Min 18 V 18 V
Supply Voltage-Nom 24 V 24 V
Supply Voltage1-Max 35 V 35 V
Supply Voltage1-Min 9 V 9 V
Surface Mount NO NO
Technology BCDMOS BCDMOS
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish TIN LEAD MATTE TIN
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position SINGLE DUAL
Turn-off Time 20 µs 20 µs
Turn-on Time 100 µs 100 µs
Base Number Matches 1 1
Samacsys Manufacturer STMicroelectronics
Package Code DIP
Seated Height-Max 5.08 mm
Width 7.62 mm

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