TDP08H1SBD1R
vs
SMP706
feature comparison
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
C & K COMPONENTS LLC
|
FUJISOKU CORP
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8536.50.70.00
|
8536.50.90.65
|
| Factory Lead Time |
48 Weeks
|
|
| Actuator Material |
POLYAMIDE
|
|
| Actuator Type |
PIANO
|
PIANO
|
| Center Contact Material |
COPPER ALLOY
|
|
| Center Contact Plating |
GOLD OVER NICKEL
|
|
| Contact Current(DC)-Max |
0.025 A
|
0.025 A
|
| Contact (DC) Max Rating R Load |
0.025A@24VDC
|
0.025A@24VDC
|
| Contact Function |
OFF-ON
|
ON-OFF
|
| Contact Resistance |
0.1 mΩ
|
0.05 mΩ
|
| Contact Voltage(DC)-Max |
24 V
|
24 V
|
| Dielectric Withstand Volts |
300VAC V
|
500VAC V
|
| Electrical Life |
1000 Cycle(s)
|
500 Cycle(s)
|
| End Contact Material |
COPPER ALLOY
|
|
| End Contact Plating |
GOLD OVER NICKEL
|
|
| Housing Material |
GLASS FILLED POLYPHENYLENE SULPHIDE
|
|
| Insulation Resistance |
100000000 Ω
|
1000000000 Ω
|
| JESD-609 Code |
e4
|
|
| Mounting Feature |
SURFACE MOUNT-RIGHT ANGLE
|
SURFACE MOUNT-RIGHT ANGLE
|
| Number of Switch Sections |
8
|
6
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-20 °C
|
| Sealing |
MOLDED
|
|
| Surface Mount |
NO
|
NO
|
| Switch Function |
SPST
|
SPST
|
| Switch Type |
PIANO DIP SWITCH
|
PIANO DIP SWITCH
|
| Terminal Finish |
GOLD OVER NICKEL
|
|
| Terminal Material |
COPPER ALLOY
|
|
| Termination Type |
SOLDER
|
SOLDER
|
| Base Number Matches |
1
|
4
|
| Actuator Length |
|
0.043 inch
|
| Additional Feature |
|
TAPE SEAL TYPE
|
| Body Breadth |
|
6.5024 mm
|
| Body Height |
|
4.3434 mm
|
| Body Length or Diameter |
|
16.8148 mm
|
| Contact Timing |
|
MAKE-BEFORE-BREAK
|
| Solderability |
|
HAND
|
| Switch Action |
|
VERTICAL
|
| Washability |
|
SOLVENT
|
|
|
|
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