TEA1118AT vs TEA1118T feature comparison

TEA1118AT NXP Semiconductors

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TEA1118T NXP Semiconductors

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP, SOP14,.25
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e4
Length 8.65 mm 8.65 mm
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 75 °C 75 °C
Operating Temperature-Min -25 °C -25 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Current-Max 1.4 mA 1.4 mA
Supply Voltage-Nom 2.9 V 2.9 V
Surface Mount YES YES
Technology BIPOLAR BIPOLAR
Telecom IC Type CORDLESS TELEPHONE BASEBAND CIRCUIT CORDLESS TELEPHONE BASEBAND CIRCUIT
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL EXTENDED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.9 mm 3.9 mm
Base Number Matches 5 5

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