TEA2025B
vs
TPA3138D2PWP
feature comparison
| Pbfree Code |
Yes
|
Yes
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP-16
|
HTSSOP,
|
| Pin Count |
16
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.33.00.01
|
8542.33.00.01
|
| Samacsys Manufacturer |
STMicroelectronics
|
Texas Instruments
|
| Consumer IC Type |
AUDIO AMPLIFIER
|
CLASS D AUDIO AMPLIFIER
|
| Gain |
45 dB
|
26 dB
|
| Harmonic Distortion |
10%
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDSO-G28
|
| JESD-609 Code |
e4
|
e4
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
28
|
| Operating Temperature-Max |
150 °C
|
85 °C
|
| Output Power-Nom |
2.8 W
|
10 W
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
HTSSOP
|
| Package Equivalence Code |
DIP16,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.1 mm
|
1.2 mm
|
| Supply Current-Max |
50 mA
|
|
| Supply Voltage-Max (Vsup) |
12 V
|
14.4 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3.5 V
|
| Surface Mount |
NO
|
YES
|
| Technology |
BIPOLAR
|
CMOS
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
THROUGH-HOLE
|
GULL WING
|
| Terminal Pitch |
2.54 mm
|
0.65 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
4.4 mm
|
| Base Number Matches |
1
|
4
|
| Bandwidth-Nom |
|
22 kHz
|
| Length |
|
9.7 mm
|
| Moisture Sensitivity Level |
|
3
|
| Noise Figure-Nom |
|
102 dB
|
| Operating Temperature-Min |
|
-40 °C
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Temperature Grade |
|
INDUSTRIAL
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TEA2025B with alternatives
Compare TPA3138D2PWP with alternatives