TG2401F vs BU8242F-DXT2 feature comparison

TG2401F Toshiba America Electronic Components

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BU8242F-DXT2 ROHM Semiconductor

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Rohs Code No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer TOSHIBA CORP ROHM CO LTD
Part Package Code SOIC SOIC
Package Description HTSSOP, SOP,
Pin Count 20 20
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
JESD-30 Code R-PDSO-G20 R-PDSO-G20
JESD-609 Code e0
Length 5 mm 12.5 mm
Number of Functions 1 1
Number of Terminals 20 20
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTSSOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH SMALL OUTLINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.04 mm 2.01 mm
Supply Current-Max 170 mA
Supply Voltage-Nom 3 V
Surface Mount YES YES
Technology GAAS
Telecom IC Type CORDLESS TELEPHONE RF AND BASEBAND CIRCUIT CORDLESS TELEPHONE SUPPORT CIRCUIT
Temperature Grade INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position DUAL DUAL
Width 4.4 mm 5.4 mm
Base Number Matches 1 1

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Compare BU8242F-DXT2 with alternatives