TGA2526
vs
HMC-ALH444
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
TRIQUINT SEMICONDUCTOR INC
|
HITTITE MICROWAVE CORP
|
| Package Description |
DIE OR CHIP
|
2.64 X 1.64 MM, 0.10 MM HEIGHT, DIE-5
|
| Reach Compliance Code |
compliant
|
compliant
|
| Construction |
COMPONENT
|
COMPONENT
|
| Gain |
17.5 dB
|
15 dB
|
| Input Power-Max (CW) |
22 dBm
|
12 dBm
|
| JESD-609 Code |
e3/e4
|
e4
|
| Number of Functions |
1
|
1
|
| Operating Frequency-Max |
20000 MHz
|
12000 MHz
|
| Operating Frequency-Min |
2000 MHz
|
1000 MHz
|
| Package Equivalence Code |
DIE OR CHIP
|
DIE OR CHIP
|
| Power Supplies |
5 V
|
5 V
|
| RF/Microwave Device Type |
WIDE BAND LOW POWER
|
WIDE BAND LOW POWER
|
| Technology |
GAAS
|
GAAS
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| Additional Feature |
|
LOW NOISE
|
| Characteristic Impedance |
|
50 Ω
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Terminal Finish |
|
Gold (Au)
|
|
|
|
Compare TGA2526 with alternatives
Compare HMC-ALH444 with alternatives