TIBPAL20R6-10CFN
vs
PLQ20R6-5A
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
Part Package Code |
QFN
|
|
Package Description |
PLASTIC, CC-28
|
QCCJ,
|
Pin Count |
28
|
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
REGISTER PRELOAD; POWER-UP RESET
|
REGISTER PRELOAD; POWER-UP RESET
|
Architecture |
PAL-TYPE
|
|
Clock Frequency-Max |
55.5 MHz
|
118 MHz
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
Length |
11.5062 mm
|
|
Number of Dedicated Inputs |
12
|
12
|
Number of I/O Lines |
2
|
2
|
Number of Inputs |
14
|
|
Number of Outputs |
8
|
|
Number of Product Terms |
64
|
|
Number of Terminals |
28
|
28
|
Operating Temperature-Max |
75 °C
|
75 °C
|
Operating Temperature-Min |
|
|
Organization |
12 DEDICATED INPUTS, 2 I/O
|
12 DEDICATED INPUTS, 2 I/O
|
Output Function |
MIXED
|
MIXED
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Equivalence Code |
LDCC28,.5SQ
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
Programmable Logic Type |
OT PLD
|
OT PLD
|
Propagation Delay |
10 ns
|
8 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
4.57 mm
|
|
Supply Voltage-Max |
5.25 V
|
5.25 V
|
Supply Voltage-Min |
4.75 V
|
4.75 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
TTL
|
BICMOS
|
Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
11.5062 mm
|
|
Base Number Matches |
1
|
1
|
|
|
|
Compare TIBPAL20R6-10CFN with alternatives
Compare PLQ20R6-5A with alternatives