TIBPAL20R6-10CFN
vs
PLUS20R6-7A
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
QFN
|
|
| Package Description |
PLASTIC, CC-28
|
|
| Pin Count |
28
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
REGISTER PRELOAD; POWER-UP RESET
|
POWER-UP RESET
|
| Architecture |
PAL-TYPE
|
|
| Clock Frequency-Max |
55.5 MHz
|
74 MHz
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| Length |
11.5062 mm
|
11.505 mm
|
| Number of Dedicated Inputs |
12
|
12
|
| Number of I/O Lines |
2
|
2
|
| Number of Inputs |
14
|
|
| Number of Outputs |
8
|
|
| Number of Product Terms |
64
|
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
|
|
| Organization |
12 DEDICATED INPUTS, 2 I/O
|
12 DEDICATED INPUTS, 2 I/O
|
| Output Function |
MIXED
|
MIXED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
LDCC28,.5SQ
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Programmable Logic Type |
OT PLD
|
OT PLD
|
| Propagation Delay |
10 ns
|
10 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.57 mm
|
4.57 mm
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
11.5062 mm
|
11.505 mm
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TIBPAL20R6-10CFN with alternatives
Compare PLUS20R6-7A with alternatives