TISP8200MDR-S
vs
TISP8200MDR
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
BOURNS INC
|
BOURNS INC
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
MS-012, SO-8
|
PLASTIC, MS-012, SO-8
|
Pin Count |
8
|
8
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
16 Weeks
|
|
Samacsys Manufacturer |
Bourns
|
|
JESD-30 Code |
R-PDSO-G8
|
R-PDSO-G8
|
JESD-609 Code |
e3
|
e0
|
Length |
4.9 mm
|
4.9 mm
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Terminals |
8
|
8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.75 mm
|
1.75 mm
|
Surface Mount |
YES
|
YES
|
Telecom IC Type |
SURGE PROTECTION CIRCUIT
|
SURGE PROTECTION CIRCUIT
|
Terminal Finish |
MATTE TIN
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
3.9 mm
|
3.9 mm
|
Base Number Matches |
1
|
2
|
|
|
|