TJA1041AU
vs
TLE9250VLE
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
INFINEON TECHNOLOGIES AG
|
| Part Package Code |
DIE
|
|
| Package Description |
DIE,
|
TSON-8
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| JESD-30 Code |
R-XUUC-N14
|
S-PDSO-N8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
8
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
DIE
|
HTSON
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
UNCASED CHIP
|
SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE
|
| Qualification Status |
Not Qualified
|
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Position |
UPPER
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Date Of Intro |
|
2017-08-17
|
| JESD-609 Code |
|
e3
|
| Length |
|
3 mm
|
| Moisture Sensitivity Level |
|
2A
|
| Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
| Screening Level |
|
AEC-Q100
|
| Seated Height-Max |
|
1.1 mm
|
| Terminal Finish |
|
Tin (Sn)
|
| Terminal Pitch |
|
0.65 mm
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
| Width |
|
3 mm
|
|
|
|
Compare TJA1041AU with alternatives
Compare TLE9250VLE with alternatives