TJA1050T/CM,118 vs TJA1050U feature comparison

TJA1050T/CM,118 NXP Semiconductors

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TJA1050U NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Part Package Code SOIC DIE
Package Description 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 DIE,
Pin Count 8 8
Manufacturer Package Code SOT96-1
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 10 Weeks
Samacsys Manufacturer NXP
Data Rate 1000 Mbps
JESD-30 Code R-PDSO-G8 R-XUUC-N8
JESD-609 Code e4 e4
Length 4.9 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Transceivers 1
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Code SOP DIE
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE UNCASED CHIP
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Current-Max 0.075 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Technology CMOS
Telecom IC Type INTERFACE CIRCUIT INTERFACE CIRCUIT
Temperature Grade AUTOMOTIVE AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm
Terminal Position DUAL UPPER
Time@Peak Reflow Temperature-Max (s) 30
Width 3.9 mm
Base Number Matches 1 4

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