TJA1055T/C,512
vs
TJA1055T/CM,118
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
3.90 MM, PLASTIC, SOT-108-1, MS-012, SOP-14
|
3.90 MM, PLASTIC, MS-012, SOT108-1, SOP-14
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
SOT108-1
|
SOT108-1
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
10 Weeks
|
| Samacsys Manufacturer |
NXP
|
NXP
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| JESD-609 Code |
e4
|
e4
|
| Length |
8.65 mm
|
8.65 mm
|
| Moisture Sensitivity Level |
3
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
1.75 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
INTERFACE CIRCUIT
|
INTERFACE CIRCUIT
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.9 mm
|
3.9 mm
|
| Base Number Matches |
1
|
1
|
| ECCN Code |
|
EAR99
|
| Number of Transceivers |
|
1
|
| Package Equivalence Code |
|
SOP14,.25
|
| Screening Level |
|
AEC-Q100
|
| Supply Current-Max |
|
0.021 mA
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TJA1055T/C,512 with alternatives
Compare TJA1055T/CM,118 with alternatives