TJF1051T/3,118 vs MCP2562FDT-H/MF feature comparison

TJF1051T/3,118 NXP Semiconductors

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MCP2562FDT-H/MF Microchip Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Not Recommended Active
Ihs Manufacturer NXP SEMICONDUCTORS MICROCHIP TECHNOLOGY INC
Part Package Code SOIC
Package Description 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8 DFN-8
Pin Count 8
Manufacturer Package Code SOT96-1
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 10 Weeks 4 Weeks
Samacsys Manufacturer NXP Microchip
Data Rate 1000 Mbps 8000 Mbps
JESD-30 Code R-PDSO-G8 S-PDSO-N8
JESD-609 Code e4 e3
Length 4.9 mm 3 mm
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Terminals 8 8
Number of Transceivers 1 1
Operating Temperature-Max 85 °C 150 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP HVSON
Package Equivalence Code SOP8,.25 SOLCC8,.12,25
Package Shape RECTANGULAR SQUARE
Package Style SMALL OUTLINE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified
Seated Height-Max 1.75 mm 1 mm
Supply Current-Max 0.07 mA 70 mA
Supply Voltage-Nom 5 V 5 V
Surface Mount YES YES
Telecom IC Type SUPPORT CIRCUIT CAN FD TRANSCEIVER
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Finish Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) MATTE TIN
Terminal Form GULL WING NO LEAD
Terminal Pitch 1.27 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 40
Width 3.9 mm 3 mm
Base Number Matches 1 1
Screening Level TS 16949

Compare TJF1051T/3,118 with alternatives

Compare MCP2562FDT-H/MF with alternatives