TK56E12N1 vs IPB100N12S305ATMA1 feature comparison

TK56E12N1 Toshiba America Electronic Components

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IPB100N12S305ATMA1 Infineon Technologies AG

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Part Life Cycle Code Active Not Recommended
Ihs Manufacturer TOSHIBA CORP INFINEON TECHNOLOGIES AG
Package Description FLANGE MOUNT, R-PSFM-T3 SMALL OUTLINE, R-PSSO-G2
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
Samacsys Manufacturer Toshiba Infineon
Avalanche Energy Rating (Eas) 110 mJ 1445 mJ
Case Connection DRAIN DRAIN
Configuration SINGLE WITH BUILT-IN DIODE SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min 120 V 120 V
Drain Current-Max (ID) 100 A 100 A
Drain-source On Resistance-Max 0.007 Ω 0.0048 Ω
FET Technology METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code TO-220AB TO-263AB
JESD-30 Code R-PSFM-T3 R-PSSO-G2
Number of Elements 1 1
Number of Terminals 3 2
Operating Mode ENHANCEMENT MODE ENHANCEMENT MODE
Operating Temperature-Max 150 °C 175 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Shape RECTANGULAR RECTANGULAR
Package Style FLANGE MOUNT SMALL OUTLINE
Polarity/Channel Type N-CHANNEL N-CHANNEL
Power Dissipation-Max (Abs) 168 W 300 W
Pulsed Drain Current-Max (IDM) 219 A 400 A
Surface Mount NO YES
Terminal Form THROUGH-HOLE GULL WING
Terminal Position SINGLE SINGLE
Transistor Application SWITCHING
Transistor Element Material SILICON SILICON
Base Number Matches 2 1
Rohs Code Yes
Factory Lead Time 52 Weeks
Feedback Cap-Max (Crss) 330 pF
JESD-609 Code e3
Moisture Sensitivity Level 1
Operating Temperature-Min -55 °C
Peak Reflow Temperature (Cel) NOT SPECIFIED
Reference Standard AEC-Q101
Terminal Finish Tin (Sn)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare TK56E12N1 with alternatives

Compare IPB100N12S305ATMA1 with alternatives