TL071MJG vs LF357AH feature comparison

TL071MJG Freescale Semiconductor

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LF357AH General Electric Solid State

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Rohs Code No No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MOTOROLA SEMICONDUCTOR PRODUCTS GENERAL ELECTRIC SOLID STATE
Package Description DIP, DIP8,.3 , CAN8,.2
Reach Compliance Code unknown unknown
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Frequency Compensation YES YES (AVCL>=5)
Input Offset Current-Max (IIO) 0.02 µA
Input Offset Voltage-Max 9000 µV 2300 µV
JESD-30 Code R-XDIP-T8 O-MBCY-W8
JESD-609 Code e0 e0
Low-Bias YES YES
Low-Offset NO NO
Neg Supply Voltage-Nom (Vsup) -15 V
Number of Functions 1 1
Number of Terminals 8 8
Operating Temperature-Max 125 °C 70 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC METAL
Package Code DIP
Package Equivalence Code DIP8,.3 CAN8,.2
Package Shape RECTANGULAR ROUND
Package Style IN-LINE CYLINDRICAL
Power Supplies +-15 V
Qualification Status Not Qualified Not Qualified
Supply Voltage-Nom (Vsup) 15 V
Surface Mount NO
Temperature Grade MILITARY COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE WIRE
Terminal Pitch 2.54 mm
Terminal Position DUAL BOTTOM
Base Number Matches 3 8
ECCN Code EAR99
HTS Code 8542.33.00.01
Bias Current-Max (IIB) @25C 0.00005 µA