TL082ACJG vs LF156H feature comparison

TL082ACJG Motorola Mobility LLC

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LF156H Raytheon Semiconductor

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOTOROLA INC RAYTHEON SEMICONDUCTOR
Part Package Code DIP
Package Description DIP, DIP8,.3 METAL CAN, TO-99, 8 PIN
Pin Count 8
Reach Compliance Code unknown unknown
ECCN Code EAR99
HTS Code 8542.33.00.01
Amplifier Type OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
Architecture VOLTAGE-FEEDBACK VOLTAGE-FEEDBACK
Average Bias Current-Max (IIB) 0.0002 µA
Bias Current-Max (IIB) @25C 0.0002 µA
Common-mode Reject Ratio-Min 80 dB
Common-mode Reject Ratio-Nom 100 dB
Frequency Compensation YES YES
Input Offset Voltage-Max 6000 µV 7000 µV
JESD-30 Code R-GDIP-T8 O-MBCY-W8
JESD-609 Code e0 e0
Length 10.415 mm
Low-Bias YES YES
Low-Offset NO NO
Neg Supply Voltage Limit-Max -18 V -22 V
Neg Supply Voltage-Nom (Vsup) -15 V -15 V
Number of Functions 2 1
Number of Terminals 8 8
Operating Temperature-Max 70 °C 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED METAL
Package Code DIP
Package Equivalence Code DIP8,.3 CAN8,.2
Package Shape RECTANGULAR ROUND
Package Style IN-LINE CYLINDRICAL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Slew Rate-Nom 13 V/us
Supply Current-Max 5.6 mA
Supply Voltage Limit-Max 18 V 22 V
Supply Voltage-Nom (Vsup) 15 V 15 V
Surface Mount NO NO
Technology JFET BIPOLAR
Temperature Grade COMMERCIAL MILITARY
Terminal Finish TIN LEAD TIN LEAD
Terminal Form THROUGH-HOLE WIRE
Terminal Pitch 2.54 mm
Terminal Position DUAL BOTTOM
Unity Gain BW-Nom 4000
Voltage Gain-Min 50000
Width 7.62 mm
Base Number Matches 5 11

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