TL16C552FNR
vs
TL16C750IPM
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
TEXAS INSTRUMENTS INC
|
| Part Package Code |
LCC
|
QFP
|
| Package Description |
GREEN, PLASTIC, LCC-68
|
LFQFP, QFP64,.47SQ,20
|
| Pin Count |
68
|
64
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.39.00.01
|
8542.31.00.01
|
| Samacsys Manufacturer |
Texas Instruments
|
Texas Instruments
|
| Additional Feature |
ENHANCED BIDIRECTIONAL PRINTER PORT
|
ALSO OPERATES AT 3.3V MINIMUM SUPPLY AT 14MHZ
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Bus Compatibility |
IBM PC-AT
|
|
| Clock Frequency-Max |
8 MHz
|
16 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.0625 MBps
|
1 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G64
|
| JESD-609 Code |
e4
|
e4
|
| Length |
24.23 mm
|
10 mm
|
| Low Power Mode |
NO
|
YES
|
| Moisture Sensitivity Level |
3
|
3
|
| Number of DMA Channels |
|
|
| Number of I/O Lines |
8
|
|
| Number of Serial I/Os |
2
|
1
|
| Number of Terminals |
68
|
64
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
LFQFP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
QFP64,.47SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK, LOW PROFILE, FINE PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
4.57 mm
|
1.6 mm
|
| Supply Current-Max |
50 mA
|
|
| Supply Voltage-Max |
5.25 V
|
5.25 V
|
| Supply Voltage-Min |
4.75 V
|
4.75 V
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
MOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
30
|
| Width |
24.23 mm
|
10 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
1
|
1
|
|
|
|
Compare TL16C552FNR with alternatives
Compare TL16C750IPM with alternatives