TL750L12QDR
vs
MCP1804T-C002I/MB
feature comparison
| Pbfree Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
TEXAS INSTRUMENTS INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
SOIC
|
SOT-89
|
| Package Description |
SOP,
|
, TO-243
|
| Pin Count |
8
|
3
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Dropout Voltage1-Max |
0.6 V
|
0.85 V
|
| Input Voltage-Max |
26 V
|
28 V
|
| Input Voltage-Min |
13 V
|
14 V
|
| JESD-30 Code |
R-PDSO-G8
|
R-PSSO-F3
|
| Length |
4.9 mm
|
4.495 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
8
|
3
|
| Operating Temperature TJ-Max |
125 °C
|
125 °C
|
| Operating Temperature TJ-Min |
|
-40 °C
|
| Output Current1-Max |
0.15 A
|
0.15 A
|
| Output Voltage1-Max |
12.6 V
|
12.24 V
|
| Output Voltage1-Min |
11.4 V
|
11.76 V
|
| Output Voltage1-Nom |
12 V
|
12 V
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
TO-243
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Regulator Type |
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR
|
| Seated Height-Max |
1.75 mm
|
1.6 mm
|
| Surface Mount |
YES
|
YES
|
| Terminal Form |
GULL WING
|
FLAT
|
| Terminal Pitch |
1.27 mm
|
1.5 mm
|
| Terminal Position |
DUAL
|
SINGLE
|
| Voltage Tolerance-Max |
5%
|
2%
|
| Width |
3.9 mm
|
2.445 mm
|
| Base Number Matches |
1
|
1
|
| Rohs Code |
|
Yes
|
| Factory Lead Time |
|
32 Weeks, 1 Day
|
| Samacsys Manufacturer |
|
Microchip
|
| Adjustability |
|
FIXED
|
| Dropout Voltage1-Nom |
|
0.65 V
|
| Input Voltage Absolute-Max |
|
30 V
|
| JESD-609 Code |
|
e3
|
| Line Regulation-Max |
|
0.504%
|
| Load Regulation-Max |
|
0.175%
|
| Moisture Sensitivity Level |
|
1
|
| Number of Outputs |
|
1
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Equivalence Code |
|
TO-243
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Screening Level |
|
TS 16949
|
| Technology |
|
CMOS
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare TL750L12QDR with alternatives
Compare MCP1804T-C002I/MB with alternatives