TLC0820AIDW
vs
MAX150AMJP
feature comparison
| Pbfree Code |
Yes
|
No
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
MAXIM INTEGRATED PRODUCTS INC
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
GREEN, PLASTIC, SOIC-20
|
DIP, DIP20,.3
|
| Pin Count |
20
|
20
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Analog Input Voltage-Max |
8.1 V
|
5.1 V
|
| Analog Input Voltage-Min |
-0.1 V
|
-0.1 V
|
| Conversion Time-Max |
2.5 µs
|
2.5 µs
|
| Converter Type |
ADC, FLASH METHOD
|
ADC, FLASH METHOD
|
| JESD-30 Code |
R-PDSO-G20
|
R-GDIP-T20
|
| JESD-609 Code |
e4
|
e0
|
| Length |
12.8 mm
|
24.13 mm
|
| Linearity Error-Max (EL) |
0.3906%
|
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Analog In Channels |
1
|
1
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Output Bit Code |
BINARY
|
BINARY
|
| Output Format |
PARALLEL, 8 BITS
|
PARALLEL, 8 BITS
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
260
|
245
|
| Sample Rate |
0.625 MHz
|
|
| Sample and Hold / Track and Hold |
TRACK
|
TRACK
|
| Seated Height-Max |
2.65 mm
|
5.08 mm
|
| Supply Voltage-Nom |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
TIN LEAD
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.5 mm
|
7.62 mm
|
| Base Number Matches |
2
|
1
|
| ECCN Code |
|
3A001.A.2.C
|
| HTS Code |
|
8542.39.00.01
|
| Package Equivalence Code |
|
DIP20,.3
|
| Qualification Status |
|
Not Qualified
|
|
|
|
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