TLC2202CP
vs
LMC6462AIN
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Active
|
Transferred
|
| Ihs Manufacturer |
ROCHESTER ELECTRONICS LLC
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
ROHS COMPLIANT, PLASTIC, DIP-8
|
DIP-8
|
| Pin Count |
8
|
8
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| Amplifier Type |
OPERATIONAL AMPLIFIER
|
OPERATIONAL AMPLIFIER
|
| Average Bias Current-Max (IIB) |
0.0001 µA
|
0.00001 µA
|
| Common-mode Reject Ratio-Nom |
115 dB
|
74 dB
|
| Input Offset Voltage-Max |
1150 µV
|
2000 µV
|
| JESD-30 Code |
R-PDIP-T8
|
R-PDIP-T8
|
| JESD-609 Code |
e4
|
e0
|
| Length |
9.59 mm
|
9.817 mm
|
| Moisture Sensitivity Level |
NOT APPLICABLE
|
1
|
| Neg Supply Voltage Limit-Max |
-8 V
|
|
| Neg Supply Voltage-Nom (Vsup) |
-5 V
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
8
|
8
|
| Operating Temperature-Max |
70 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
260
|
| Seated Height-Max |
5.08 mm
|
5.08 mm
|
| Slew Rate-Nom |
2.7 V/us
|
0.023 V/us
|
| Supply Voltage Limit-Max |
8 V
|
16 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
40
|
| Unity Gain BW-Nom |
1900
|
50
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
2
|
| ECCN Code |
|
EAR99
|
| HTS Code |
|
8542.33.00.01
|
| Architecture |
|
VOLTAGE-FEEDBACK
|
| Common-mode Reject Ratio-Min |
|
67 dB
|
| Frequency Compensation |
|
YES
|
| Low-Bias |
|
YES
|
| Low-Offset |
|
NO
|
| Micropower |
|
YES
|
| Package Equivalence Code |
|
DIP8,.3
|
| Packing Method |
|
RAIL
|
| Qualification Status |
|
Not Qualified
|
| Slew Rate-Min |
|
0.008 V/us
|
| Supply Current-Max |
|
0.07 mA
|
|
|
|
Compare TLC2202CP with alternatives
Compare LMC6462AIN with alternatives